In 2005, we made a substantial investment in a Laser Direct Imager from Orbotech and a combination UV/CO2 laser drill/router from Excellon that have given us the ability to make a remarkable break from conventional processes. The technologies have produced pretty dramatic improvements in our yields, fine line capability, and reduced process cost, all of which will give you a better product.

Board AttributeStandard TechnologyAdvanced Technology
Layer Count4-2022-30
Board Thickness.009″ – .093″.006″ – .125″
Internal Imaging.003″/.003″.002″/.002″
Minimum Dielectric.001”.001”
Minimum Copper12µ
Minimum Drilled Hole.008″.006″
Minimum Laser Via.006”.004”
Aspect Ratio10:1> 10:1
PTH Size Tolerance.003″.002″
Impedance Tolerance+/- 10%+/- 5%
Buried ResistorsYesYes
Buried CapacitorsYesYes