Rigid Flex for Industrial and Commercial Applications

Rigid flex circuits have traditionally been used in high reliability – never fail electronic packaging for medical, aerospace and military technologies.  Electronics designers in these industries have depended on rigid flex for the ultimate in survivability in high vibration and high shock applications – where traditional connectors and/or flex cable interconnections will fail.

Increasingly flexible and rigid flex circuits are being applied to industrial and commercial applications where mean time between failure and product life are highly valued. Or, in high density applications where PWB real estate is at a premium, and the need for device functionality and miniaturization drive the need for new and creative packaging solutions.

We see greater use of flexible and rigid flex circuits where innovative packaging solutions are required to provide device functionality, miniaturization, and reliability – such as unmanned vehicles, wearable electronics, robotics, ruggedized computers, solid state disk drives, camera and optics applications.

Rigid flex technology enables manufacturers to miniaturize their products, and reduce their weight, while improving device reliability.

Capabilities

Rigid flex circuits eliminate the cables and connectors between hard boards, making them well-suited to electronic devices with multiple connections between rigid boards. They are also the ideal solution to ultra-small and dense packaging, where there is just no room for connectors, in today’s industrial electronics.

Rigid flex circuits are extremely reliable in static or dynamic flex applications. Because of their versatility, they can be a more cost-effective solution than similar cables with connectors.

Manufacturing Equipment

Registering thin laminates with other materials of varying dimensional stability, demands state-of-the-art equipment and processes. At Printed Circuits, we manufacture our circuits with the most advanced equipment on the market. Our facility features Laser Direct Imagers from Orbotech, and UV/CO2 laser drill/routers, X-ray smart drill, ENEPIG line and other process technology essential for high quality, high reliability circuits – allowing us to build most of our boards to IPC 6013 class III, or beyond.

In-Process Testing/Inspection

Printed Circuits uses microsectioning, X-ray verification, thermal stress analysis, automatic optical inspection, electrical testing, and CMM dimensioning during in-process testing and final acceptance of your circuit boards.

We use clean rooms for material layup, flying probe electrical testing, and controlled impedance modeling and test/verification to ensure that you receive the best rigid flex circuits available.

Our products are built to the highest manufacturing specifications in the industry – IPC 6013 class III or the Military performance specification MIL-PRF-31032.  Printed Circuits is certified to ISO 9001:2015, registered with the US Department of State for ITAR.

We also have the most comprehensive library of constructions approved to UL 94 V-0 standards in the industry, allowing you to certify your product to UL without the wait and cost of obtaining UL approval.

Volume and Delivery

Backed by decades of experience with flex and rigid flex circuits, we have the expertise needed to manufacture high-volume production runs as well as small-volume prototyping. We’re able to deliver quick prototypes in as little as three weeks, and high-volume orders in six to eight weeks.

To ensure successful product integration and launch, Printed Circuits offers design assistance to every client, and particularly those who are new to flex and rigid flex design. We’re capable of working with very thin dielectric materials, materials with dissimilar X/Y dimensional stability, and very thin circuit board composites. We work with mechanical, electrical, process, CAD and layout engineers alike – offering design recommendations provide optimized manufacturing yields and cost reduction.

Some customers request several different designs when prototyping new concepts and products. We are happy to accommodate, enabling you to check and test your assumptions on impedance performance, cross talk, EMI shielding and antenna structures before production begins.

Most of our work meets IPC 6013 class III requirements or beyond, making us the ideal provider of flexible and rigid flex circuits for your application. We have excellent quality management systems, finely tuned processes, and the experienced personnel needed to deliver defect-free, high-quality and highly-reliable electronic packaging solutions for your project.

Our customer satisfaction surveys consistently return high marks for responsiveness, design assistance, high quality, and affordability. Quality audits from our customers further speak to the strength of our processes, personnel, and equipment.

Printed Circuits is pleased to offer cutting-edge solutions to the packaging challenges posed by modern electronic packaging requirements. If you’d like to partner with us on your next product or project, contact us today.