Rigid Flex for Aerospace Applications
As advances in aerospace technology lead to better and more capable aircraft, missiles, satellites and unmanned vehicles, aerospace electronics systems are exposed to higher levels of shock and vibration. At the same time, the aerospace industry is driving demand for weight reduction and increased component density and functionality in the electronic package.
To meet these demands, aerospace manufacturers need a packaging solution that offers higher reliability and greater survivability without undermining performance. As traditional flex cables with connectors become increasingly inadequate in these applications, lightweight rigid flex printed circuits offer a superior packaging alternative.
Rigid flex circuits are ideal for aerospace and satellite electronics packaging – “never fail” electronics applications, and offer unmatched survivability in high-shock and high vibration environments.
They can also be built using very thin dielectrics to reduce your total package weight, which reduces fuel requirements and increases mission endurance.
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Registering thin laminates with other materials of varying dimensional stability, demands state-of-the-art equipment and processes. At Printed Circuits, we manufacture our circuits with the most advanced equipment on the market. Our facility features Laser Direct Imagers from Orbotech, and UV/CO2 laser drill/routers, X-ray smart drill, ENEPIG line and other process technology for high reliability circuits – allowing us to build most of our boards to IPC 6013 class III, or beyond.
Printed Circuits uses microsectioning, X-ray verification, thermal stress analysis, automatic optical inspection, electrical testing, and CMM dimensioning during in-process testing and final acceptance of your circuit boards.
We use clean rooms for material layup, flying probe electrical testing, and controlled impedance modeling and test/verification to ensure that you receive the best rigid flex circuits available.
Our products are built to the highest manufacturing specifications in the industry –IPC 6013 class III or the Military performance specification. Printed Circuits is certified to ISO 9001:2015, registered with the US Department of State for ITAR, and we have the most comprehensive library of constructions approved to UL 94 V-0 standards in the industry, allowing you to certify your product to UL without the wait and cost of obtaining UL approval.
Volume and Delivery
Backed by decades of experience with flex and rigid flex circuits, we have the expertise needed to manufacture high-volume production runs as well as small-volume prototyping. We’re able to deliver quick prototypes in as little as three weeks, and high-volume orders in six to eight weeks.
To ensure successful product integration and launch, Printed Circuits offers design assistance to every client, and particularly those who are new to flex and rigid flex design. We’re capable of working with very thin dielectric materials, materials with dissimilar X/Y dimensional stability, and very thin circuit board composites. We work with mechanical, electrical, process, CAD and layout engineers alike – offering design recommendations provide optimized manufacturing yields and cost reduction.
Some customers request several different designs when prototyping new concepts and products. We are happy to accommodate, enabling you to check and test your design assumptions before production begins.
Most of our work meets IPC 6013 class III requirements or beyond, making us the ideal provider of flexible and rigid flex circuits for aerospace applications. We have excellent quality management systems, finely tuned processes, and the experienced personnel needed to deliver defect-free, high-quality and highly-reliable military electronics components.
Our customer satisfaction surveys consistently return high marks for responsiveness, design assistance, high quality, and affordability. Quality audits from our customers further speak to the strength of our processes, personnel, and equipment.
Printed Circuits is pleased to offer cutting-edge solutions to the packaging challenges posed by modern aerospace manufacturing. If you’d like to partner with us on your next product or project, contact us today.