|A few years
ago we made a substantial investment in a Laser Direct Imager from Orbotech
and a combination UV/CO2 laser drill/router from Excellon that have given us the ability to make a remarkable break from conventional
processes. The technologies have produced pretty dramatic improvements
in our yields, fine line capability, and reduced process cost, all of
which will give you a better product. To find out more about either technology, please click on the photo of the Orbotech LDI or Excellon Laser to visit their websites.
||Laser routing provides + 0.002"
||Laser vias and Laser direct imaging in rigid flex
day new board designs push one or more areas of our technology curve and
help us produce tighter tolerances and denser boards. The capabilities
that we have listed below are given in general terms because they are
interdependent – and it is possible that your requirements extend
beyond the ranges given below. If your project is outside of those ranges,
give us a call. We may have already produced it, and if not we’d
like to work
with you to expand our capabilities.
|Minimum Drilled Hole
|Minimum Laser Via
|PTH Size Tolerance