This is another pure flex package; 14 layers bonded with flexible bond plies; controlled depth laser vias on the outer
three layers of each side.

Application: Infrared Camera
Size: 6.6” by 1.6”
Layers: 14 overall, pure flex
Materials: Adhesiveless flex, Adhesive bond plies and coverlay
Traces: 4/4 innerlayers - 4/4 outerlayers
Minimum hole: .006
Minimum pad: .012
Thickness: .060
Other: Controlled depth laser vias 3/8/3 construction, 5 Lamination cycles and Silver epoxy shielding

This board illustrates how designers use flex to reduce board thickness as well as package size and weight, and incorporate connectors into the bare board design.

Application: “Wearable” insulin pump
Size: 3” by 3”
Layers: 6 overall, 2 flex
Materials: Adhesiveless flex, Polyimide core, Polyimide no-flow prepreg
Traces: 4/4 innerlayers - 4/4 outerlayers
Minimum hole: .010
Minimum pad: .022
Thickness: .030
Other: ENIG

This is good example of how flex can create very innovative, dense, thin, light packaging. This board is bonded with a
no-flow prepreg.

Application: Speech processor for hearing implant
Size: 3.5” by 2.75”
Layers: 4 overall, 2 flex
Materials: Adhesiveless flex, Epoxy no-flow prepreg
Traces: 4/4 innerlayers
4/4 outerlayers
Minimum hole: .010
Minimum pad: .020
Thickness: .021
Other: Via in pads and ENIG

This is a large board for a medical device that is eighteen layers and presents difficult registration due to the number
of layers and board’s dimensions.

Application: Medical Imaging
Size: 4.5” by 22.25”
Layers: 18 overall, four layers flex with four layers of epoxy silver shielding
Materials: Adhesiveless flex, Polyimide core ,Polyimide no flow prepreg
Traces: 7/4 innerlayers - 7/5 outerlayers
Minimum hole: .024
Minimum pad: .040
Thickness: .093 ± .005
Other: Silver epoxy shielding

This board is for a computer application with controlled impedance on five layers, and with selective gold electro-plate and electroless nickel – immersion gold.

Application: Computer workstation
Size: 12” by 6.5”
Layers: 12 overall, 2 flex
Materials: Adhesiveless flex, Polyimide core, Polyimide no-flow prepreg
Traces: 4.5/4 innerlayers flex - 3.2/4 innerlayers hardboard - 4/6 outerlayers
Minimum hole: .0145
Minimum pad: .025
Thickness: .093 + .008
Other: Controlled impedance and 5 layers 50 ohm + 10%

This board was manufactured for a high volume telecommunications device, it features a low cost lay-up with controlled impedance on three layers.

Application: High volume telecommunications
Size: 1.5” by 0.5”
Layers: 6 overall, 2 flex
Materials: Adhesiveless flex, Epoxy no-flow prepreg
Traces: 4/6 innerlayers - 8/6 outerlayers
Minimum hole: .0135
Minimum pad: .027
Thickness: .039 + .005
Other: Controlled impedance on 3 layers and selective ENIG and fused solder

This is a unique board that shows how flex can be used for high density applications; the board is 12 layers and thinner than a credit card. It uses a polyimide cast adhesive so the package is pure flex.

Application: Engine control unit for robot
Size: 3.75” by 2.875”
Layers: 12 overall, pure flex
Materials: Adhesiveless flex, Fusible polyimide bond ply
Traces: 4.5/4 innerlayers - 5/4 outerlayers
Minimum hole: .010
Minimum pad: .018
Thickness: .020
Other: 12 micron copper on innerlayers, fusible polyimide adhesive and pure polyimide package

This is an example of flex used in a rigid application; four layer board with .006 controlled depth, laser vias, with each
part individually scaled at drilling. Innerlayers have 2/1.5 spacing.

Application: Carrier for piezo chip
Size: 2.25” by 2.375”
Layers: 4 overall, pure flex
Materials: Adhesiveless flex, Fusible polyimide bond ply
Traces: 2/1.5 innerlayers - 4/4 outerlayers
Minimum hole: .006
Minimum pad: .012
Thickness: .016
Other: Controlled depth laser vias, laser clearing of pads in chip cavity and Rogers R 8080 Photoimagable Coverlay

This is a six-layer rigid flex board for a micro CCD bar code reader for a PDA, that also doubles as a camera.

Application: CCD Camera/bar code reader assembly
Size: 1.4” by 1.6”
Layers: 6 overall, all flex
Materials: Adhesiveless flex, Epoxy no-flow prepreg
Traces: 4/4 innerlayers - 4/4 outerlayers
Minimum hole: .008
Minimum pad: .018
Thickness: .022 + .002
Other: Flex areas are die cut for lower cost, conventional .008 vias for lower cost and ENIG